PowerPC 740 and PowerPC 750 Embedded Microprocessor
IBM CMOS 0.20 um Copper Technology EMPPC740L and EMPPC750L
Figure 22. Thermal Performance of Select Thermal Interface Material
Silicone Sheet (0.006 inch)
+
Bare Joint
Floroether Oil Sheet (0.007 inch)
Graphite/Oil Sheet (0.005 inch)
Synthetic Grease
2
+
+
1.5
+
1
0.5
0
0
10
20
30
40
50
60
70
80
Contact Pressure (PSI)
The board designer can choose between several types of thermal interfaces. Heat sink adhesive materials
should be selected based upon high conductivity, yet adequate mechanical strength to meet equipment
shock/vibration requirements. There are several commercially-available thermal interfaces and adhesive
materials provided by the following vendors.
Dow-Corning Corporation
Dow-Corning Electronic Materials
P.O. Box 0997
517-496-4000
Midland, MI 48686-0997
Page 42
Version 1.51
PowerPC 740 and PowerPC 750 Datasheet
5/20/99
IBM [ IBM ]
