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IBM25EMPPC750LCBE4000 参数 Datasheet PDF下载

IBM25EMPPC750LCBE4000图片预览
型号: IBM25EMPPC750LCBE4000
PDF下载: 下载PDF文件 查看货源
内容描述: [RISC Microprocessor, 32-Bit, 400MHz, CMOS, CBGA360, 25 X 25 MM, 1.27 MM PITCH, CERAMIC, BGA-360]
分类和应用: 时钟外围集成电路
文件页数/大小: 50 页 / 600 K
品牌: IBM [ IBM ]
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PowerPC 740 and PowerPC 750 Embedded Microprocessor  
IBM CMOS 0.20 um Copper Technology EMPPC740L and EMPPC750L  
Figure 22. Thermal Performance of Select Thermal Interface Material  
Silicone Sheet (0.006 inch)  
+
Bare Joint  
Floroether Oil Sheet (0.007 inch)  
Graphite/Oil Sheet (0.005 inch)  
Synthetic Grease  
2
+
+
1.5  
+
1
0.5  
0
0
10  
20  
30  
40  
50  
60  
70  
80  
Contact Pressure (PSI)  
The board designer can choose between several types of thermal interfaces. Heat sink adhesive materials  
should be selected based upon high conductivity, yet adequate mechanical strength to meet equipment  
shock/vibration requirements. There are several commercially-available thermal interfaces and adhesive  
materials provided by the following vendors.  
Dow-Corning Corporation  
Dow-Corning Electronic Materials  
P.O. Box 0997  
517-496-4000  
Midland, MI 48686-0997  
Page 42  
Version 1.51  
PowerPC 740 and PowerPC 750 Datasheet  
5/20/99  
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