IBM11M4730C4M x 72 E12/10, 5.0V, Au.
Preliminary
Features
• 168 Pin JEDEC Standard, Unbuffered 8 Byte Dual
In-line Memory Module
• 16Mx72 Extended Data Out Page Mode DIMM
S
• Performance:
-6R
t
RAC
t
CAC
t
AA
t
RC
t
HPC
RAS Access Time
CAS Access Time
Access Time From Address
Cycle Time
EDO Mode Cycle Time
60ns
18ns
30ns
104ns
25ns
IBM11N16845BB
IBM11N16845CB
16M x 72 Super EOS Module
•
Provides Chip-Kill (ECC) protection transparently to
an existing Single Error Correction
(SEC) system
• System Performance Benefits:
-Non buffered for increased performance
-Reduced noise (35 VSS/VCC pins)
-Serial PDs
• Extended Data Out (EDO) Mode, Read-Modify-Write
Cycles
• Refresh Modes: RAS-Only, CBR and Hidden Refresh
• 4096 refresh cycles distributed across 64ms for CBR
Refresh
• 12/12 or 13/11 addressing (Row/Column)
• Card size: 5.25" x 1.5" x 0.354"
• DRAMS in SOJ Package
• Au contacts
• All inputs and outputs are LVTTL (3.3V) compatible
• Single 3.3V
±
0.15V Power Supply
• Optimized for ECC applications
Description
The IBM11N16845BB and IBM11N16845CB are industry
standard 168-pin 8-byte Dual In-line Memory Modules
(DIMMs) which are organized as a 16Mx72 high speed
memory array supporting EDO applications. The DIMM
uses 18 16Mx4 EDO DRAMs in SOJ packages along with
an ASIC and check bit DRAMs to provide an SEC ECC
system with transparent chip kill protection.
The DIMMs use serial presence detects implemented via
a serial EEPROM using the two pin I
2
C protocol. This
communication protocol uses Clock (SCL) and Data I/O
(SDA) lines to synchronously clock data between the
master (system logic) and the slave EEPROM device
(DIMM). The EEPROM device address pins (SA0-2) are
brought out to the DIMM tabs to allow 8 unique
DIMM/EEPROM addresses. The first 128 bytes are uti-
lized by the DIMM manufacturer and the second 128
bytes of serial PD data are available to the customer.
All IBM 168-pin DIMMs provide a high performance, flexi-
ble 8-byte interface in a 5.25” long space-saving footprint.
Related products include the buffered DIMMs (x64, x72
parity and x72 ECC Optmized) for applications which can
benefit from the on-card buffers.
Card Outline
(Front)
(Back)
1
85
10 11
94 95
40 41
124 125
84
168
75H5487
GA14-4642-00
Revised 11/96
©IBM Corporation. All rights reserved.
Use is further subject to the provisions at the end of this document.
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