HY29F002T
ORDERING INFORMATION
Hynix products are available in several speeds, packages and operating temperature ranges. The
ordering part number is formed by combining a number of fields, as indicated below. Refer to the ‘Valid
Combinations’ table, which lists the configurations that are planned to be supported in volume. Please
contact your local Hynix representative or distributor to confirm current availability of specific configura-
tions and to determine if additional configurations have been released.
HY29F002
X
X
-
X
X
X
SPECIAL INSTRUCTIONS
TEMPERATURE RANGE
Blank = Commercial ( 0 to +70 °C)
SPEED OPTION
45 = 45 ns
55 = 55 ns
70 = 70 ns
90 = 90 ns
PACKAGE TYPE
C = 32-Pin Plastic Leaded Chip Carrier (PLCC)
T = 32-Pin Thin Small Outline Package (TSOP)
BOOT BLOCK LOCATION
T= Top Boot Block
DEVICE NUMBER
HY29F002 = 2 Megabit (256K x 8) CMOS 5 Volt-Only Sector
Erase Flash Memory
VALID COMBINATIONS
Package and Speed
TSOP
PLCC
70 ns
C-70
Temperature
45 ns
55 ns
70 ns
90 ns
45 ns
55 ns
90 ns
Commercial
T-45
T-55
T-70
T-90
C-45
C-55
C-90
Note:
1. The complete part number is formed by appending the Boot Block Location code and the suffix shown in the table above
to the Device Number. For example, the part number for a 90 ns, Commercial temperature range device in the TSOP
package with the top boot block is HY29F002TT-90.
Rev. 4.1/May 01
37
HYNIX [ HYNIX SEMICONDUCTOR ]
