Spec. No. : IC200401
Issued Date : 2004.02.01
Revised Date : 2005.07.14
Page No. : 7/8
HI-SINCERITY
MICROELECTRONICS CORP.
TO-220AB Dimension
DIM
A
B
C
D
E
F
Min.
5.58
8.38
4.40
1.15
0.35
2.03
9.66
-
Max.
7.49
Marking:
F
A
B
H
8.90
Pb Free Mark
(Note)
Pb-Free: "
.
"
4.70
E
Normal: None
H
E
1.39
C
D
1 1 1 7
Product Series
ADJ(A),1.8(B),2.5(C)
3.3(D),5(E)
0.60
2.92
Date Code
Control Code
G
H
I
10.28
*16.25
*3.83
4.00
K
Note: Green label is used for pb-free packing
Pin Style: 1.ADJ/GND 2(Tab).VOUT 3.VIN
-
M
I
J
K
L
M
N
O
P
3.00
0.75
2.54
1.14
-
12.70
14.48
3
N
0.95
G
L
2
1
Material:
3.42
• Lead solder plating: Sn60/Pb40 (Normal),
Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free)
• Mold Compound: Epoxy resin family,
flammability solid burning class: UL94V-0
1.40
Tab
*2.54
14.27
15.87
P
O
J
*: Typical, Unit: mm
3-Lead TO-220AB
Plastic Package
HSMC Package Code: E
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
• HSMC reserves the right to make changes to its products without notice.
• HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory:
• Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454
• Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel: 886-3-5983621~5 Fax: 886-3-5982931
H1117 Series
HSMC Product Specification
HSMC [ HI-SINCERITY MOCROELECTRONICS ]
