Spec. No. : IC200401
Issued Date : 2004.02.01
Revised Date : 2005.07.14
Page No. : 5/8
HI-SINCERITY
MICROELECTRONICS CORP.
SOT-223 Dimension
DIM
A
Min.
2.90
6.70
3.30
0.60
*2.30
6.30
1.40
0.25
0.02
*13o
0 o
Max.
3.10
7.30
3.70
0.80
-
Marking:
A
2
F
B
Pb Free Mark
(Note)
Pb-Free: " . "
H
S J
C
Normal: None
1 1 1 7 -
Product Series
D
(ADJ,1.8,2.5,3.3,5)
E
Control Code
Date Code
B
C
F
6.70
1.80
0.35
0.10
-
G
H
1
3
Note: Green label is used for pb-free packing
Pin Style: 1.ADJ/GND 2.VOUT 3.VIN
I
a1
a2
D
E
Material:
10 o
• Lead solder plating: Sn60/Pb40 (Normal),
Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free)
• Mold Compound: Epoxy resin family,
flammability solid burning class: UL94V-0
*: Typical, Unit: mm
a1
H
I
G
a2
3-Lead SOT-223 Plastic
Surface Mounted Package
HSMC Package Code: SJ
SOT-89 Dimension
DIM
A
Min.
4.40
4.05
1.50
2.40
0.36
*1.50
*3.00
1.40
0.35
Max.
4.60
4.25
1.70
2.60
0.51
-
Marking:
C
H
Date Code
Control Code
Pb Free Mark
B
C
D
E
(Note)
Pb-Free: "
"
H 1 1 1 7
Normal: None
D
B
1
2
3
F
Product Series
ADJ(A),1.8(B),2.5(C),3.3(D),5(E)
G
H
I
-
1.60
0.41
Note: Green label is used for pb-free packing
Pin Style: 1.ADJ/GND 2.VOUT 3.VIN
I
E
F
*: Typical, Unit: mm
G
A
Material:
• Lead solder plating: Sn60/Pb40 (Normal),
Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free)
• Mold Compound: Epoxy resin family,
flammability solid burning class: UL94V-0
3-Lead SOT-89 Plastic
Surface Mounted Package
HSMC Package Code: M
H1117 Series
HSMC Product Specification
HSMC [ HI-SINCERITY MOCROELECTRONICS ]
