Insulation Related Specifications (HCPL-2731/2730/0731/0730)
8-Pin DIP
(300 Mil) SO-8
Parameter
Symbol
Value
Value Units
Conditions
Minimum External Air
Gap (External
Clearance)
Minimum External
Tracking (External
Creepage)
Minimum Internal Plastic
Gap (Internal Clearance)
L(101)
7.1
4.9
mm
mm
mm
Measured from input terminals to
output terminals, shortest distance
through air.
Measured from input terminals to
output terminals, shortest distance
path along body.
Through insulation distance, conductor
to conductor, usually the direct
distance between the photoemitter and
photodetector inside the optocoupler
cavity.
L(102)
7.4
4.8
0.08
0.08
Tracking Resistance
(Comparative Tracking
Index)
CTI
200
IIIa
200
IIIa
Volts DIN IEC 112/ VDE 0303 Part 1
Isolation Group
Material Group DIN VDE 0110
Option 300 – surface mount classification is Class A in accordance with CECC 00802.
Absolute Maximum Ratings (No Derating Required up to 85°C)
Parameter
Storage Temperature
Operating Temperature
Symbol
Min.
-55
-40
Max.
125
85
Units
°C
°C
TS
TA
Average Forward Input Current
Peak Forward Input Current
IF(AVG)
IFPK
20
40
mA
mA
(50% Duty Cycle, 1 ms Pulse Width)
Reverse Input Voltage (Each Channel)
Input Power Dissipation (Each Channel)
Output Current (Each Channel)
Supply Voltage and Output Voltage
(HCPL-2731, HCPL-0731)
(VCC - Pin 8-5, VO - Pin 7,6-5) -Note 1
Supply Voltage and Output Voltage
(HCPL-2730, HCPL-0730)
VR
PI
IO
5
V
mW
mA
V
35
60
18
VCC
-0.5
-0.5
VCC
7
V
(VCC - Pin 8-5, VO - Pin 7,6-5) -Note 1
Output Power Dissipation (Each Channel) -Note 12
Total Power Dissipation (Each Channel)
PO
PT
100
135
mW
mW
Lead Solder Temperature (for Through Hole Devices)
260°C for 10 sec., 1.6 mm below seating plane
Reflow Temperature Profile
See Package Outline Drawings section
(for SOIC-8 and Option #300)
1-113
HP [ HEWLETT-PACKARD ]
