Small Outline SO-8 Package (HCPL-0731/HCPL-0730)
8
7
6
5
5.842 ± 0.203
(0.236 ± 0.008)
XXX
3.937 ± 0.127
(0.155 ± 0.005)
YWW
TYPE NUMBER
(LAST 3 DIGITS)
DATE CODE
1
2
3
4
0.381 ± 0.076
(0.016 ± 0.003)
1.270
(0.050)
BSG
0.432
(0.017)
7°
5.080 ± 0.127
(0.200 ± 0.005)
45° X
3.175 ± 0.127
(0.125 ± 0.005)
0.228 ± 0.025
(0.009 ± 0.001)
1.524
(0.060)
0.152 ± 0.051
(0.006 ± 0.002)
DIMENSIONS IN MILLIMETERS (INCHES).
LEAD COPLANARITY = 0.10 mm (0.004 INCHES).
0.305
(0.012)
MIN.
Solder Reflow Temperature Profile (HCPL-073X and Gull Wing Surface Mount Option 300 Parts).
260
240
∆T = 145°C, 1°C/SEC
220
∆T = 115°C, 0.3°C/SEC
200
180
160
140
120
100
80
∆T = 100°C, 1.5°C/SEC
60
40
20
0
0
1
2
3
4
5
6
7
8
9
10
11
12
TIME – MINUTES
Note: Use of nonchlorine activated fluxes is highly recommended.
Regulatory Information
The HCPL-2731/2730 have been
approved by the following
organizations:
UL
CSA
Recognized under UL 1577,
Component Recognition
Program, File E55361.
Approved under CSA Component
Acceptance Notice #5, File CA
88324.
1-112
HP [ HEWLETT-PACKARD ]
