Maximum Solder Reflow Thermal Profile
260
240
∆T = 145°C, 1°C/SEC
220
200
180
160
140
120
100
80
∆T = 115°C, 0.3°C/SEC
∆T = 100°C, 1.5°C/SEC
60
40
20
0
0
1
2
3
4
5
6
7
8
9
10
11
12
TIME – MINUTES
(NOTE: USE OF NON-CHLORINE ACTIVATED FLUXES IS RECOMMENDED.)
Absolute Maximum Ratings
Parameter
Storage Temperature
Ambient Operating Temperature
Supply Voltage
Symbol
Min.
-55
-40
0
Max.
+125
+85
5.5
Units
°C
°C
V
Note
T
S
T
A
V
DD
Input Voltage
Output Voltage
All Inputs
All Outputs
-0.5
-0.5
V
V
DD
+ 0.5
+ 0.5
V
V
DD
Lead Solder Temperature
Solder Reflow Temperature Profile
260°C for 10 seconds, 1.6 mm below seating plane
17
See Reflow Thermal Profile
Note:
17. HP recommends the use of non-chlorinated solder fluxes.
Recommended Operating Conditions
Parameter
Ambient Operating Temperature
Supply Voltage
Symbol
Min.
-40
4.5
0
Max.
+85
5.5
Units
°C
V
Note
T
A
V
DD
Input Voltage
All Inputs
V
DD
V
1-275
HP [ HEWLETT-PACKARD ]
