5
Absolute Maximum Ratings
Storage Temperature Range, TS .................................. -65°C to +150°C
Operating Temperature, TA ......................................... -55°C to +125°C
Case Temperature, TC ................................................................+170°C
Junction Temperature, TJ ..........................................................+175°C
Lead Solder Temperature .............................................. 260°C for 10 s
Average Forward Curre, IF AVG (each channel) ............................. 8 mA
Peak Input Current, IF PK (each channel) ............................... 20 mA[1]
Reverse Input Voltage, VR (each channel) ....................................... 3 V
Supply Voltage ,VCC .............................................. 0.0 V min., 20 V max.
Average Output Current, IO (each channel) ................................. 15 mA
Output Voltage, VO (each channel) .................... –0.3 V min., 20 V max.
Package Power Dissipation, Pd (each channel) ......................... 200 mW
Single Channel Product Only
Tri-State Enable Voltage, VE ............................... –0.3 V min., 20 V max.
8 Pin Ceramic DIP Single Channel Schematic
ANODE
CATHODE
Note enable pin 6. An external 0.01 µF to 0.1 µF bypass capacitor is recommended
between VCC and ground for each package type.
ESD Classification
(MIL-STD-883, Method 3015)
HCPL-5200/01/0K, HCPL-6230/31/3K ................................(∆), Class 1
HCPL-5230/31/3K, HCPL-6250/51/5K ............................ (Dot), Class 3
Recommended Operating Conditions
Parameter
Symbol Min.
Max.
20
8
Units
V
mA
Power Supply Voltage
Input Current, High Level,
Each Channel
VCC
IFH
4.5
2
Input Voltage, Low Level,
Each Channel
Fan Out (TTL Load)
Each Channel
VFL
N
0
0.8
4
V
Single Channel Product Only
High Level Enable Voltage
Low Level Enable Voltage
VEH
VEL
2.0
0
20
0.8
V
V
HP [ HEWLETT-PACKARD ]
