4
Leaded Device Marking
Leadless Device Marking
Agilent LOGO
A QYYWWZ
XXXXXX
XXXXXXX
XXX XXX
50434
COMPLIANCE INDICATOR,*
DATE CODE, SUFFIX (IF NEEDED)
Agilent LOGO
Agilent P/N
PIN ONE/
ESD IDENT
A QYYWWZ
XXXXXX
XXXX
XXXXXX
XXX 50434
COMPLIANCE INDICATOR,*
DATE CODE, SUFFIX (IF NEEDED)
DSCC SMD*
DSCC SMD*
Agilent FSCN*
Agilent P/N
DSCC SMD*
DSCC SMD*
PIN ONE/
COUNTRY OF MFR.
Agilent FSCN*
COUNTRY OF MFR.
ESD IDENT
*QUALIFIED PARTS ONLY
*QUALIFIED PARTS ONLY
Hermetic Optocoupler Options
Option
Description
100
Surface mountable hermetic optocoupler with leads trimmed for butt joint assembly. This
option is available on commercial and hi-rel product in 8 pin DIP (see drawings below for
details).
4.32 (0.170)
MAX.
0.51 (0.020)
1.14 (0.045)
MIN.
0.20 (0.008)
0.33 (0.013)
1.40 (0.055)
2.29 (0.090)
2.79 (0.110)
0.51 (0.020)
MAX.
7.36 (0.290)
7.87 (0.310)
NOTE: DIMENSIONS IN MILLIMETERS (INCHES).
200
300
Lead finish is solder dipped rather than gold plated. This option is available on commercial
and hi-rel product in 8 pin DIP. DSCC Drawing part numbers contain provisions for lead
finish. All leadless chip carrier devices are delivered with solder dipped terminals as a
standard feature.
Surface mountable hermetic optocoupler with leads cut and bent for gull wing assembly. This
option is available on commercial and hi-rel product in 8 pin DIP (see drawings below for
details). This option has solder dipped leads.
4.57 (0.180)
MAX.
4.57 (0.180)
MAX.
0.20 (0.008)
0.33 (0.013)
0.51 (0.020)
MIN.
5° MAX.
1.40 (0.055)
1.65 (0.065)
9.65 (0.380)
9.91 (0.390)
2.29 (0.090)
2.79 (0.110)
0.51 (0.020)
MAX.
NOTE: DIMENSIONS IN MILLIMETERS (INCHES).
HP [ HEWLETT-PACKARD ]
