3
Functional Diagrams
8 Pin DIP
Through Hole
1 Channel
8 Pin DIP
Through Hole
2 Channels
16 Pin Flat Pack
Unformed Leads
4 Channels
20 Pad LCCC
Surface Mount
2 Channels
15
16
15
14
13
1
2
3
4
V
CC2
V
8
7
6
5
V
8
7
6
5
1
2
3
4
1
2
3
4
CC
CC
V
CC
19
20
13
12
V
V
O2
GND
V
O1
V
V
V
V
V
O
O1
O2
O3
O4
2
V
O2
V
CC1
12
11
5
6
7
8
2
3
10
V
E
O1
GND
GND
GND
1
GND 10
9
7
8
Note: Multichannel DIP and flat pack devices have common VCC and ground. Single channel DIP has an enable pin 6. LCCC (leadless
ceramic chip carrier) package has isolated channels with separate VCC and ground connections.
7.24 (0.285)
Outline Drawings
6.99 (0.275)
16 Pin Flat Pack, 4 Channels
2.29 (0.090)
MAX.
1.27 (0.050)
REF.
11.13 (0.438)
10.72 (0.422)
0.46 (0.018)
0.36 (0.014)
8.13 (0.320)
MAX.
2.85 (0.112)
MAX.
0.88 (0.0345)
MIN.
0.31 (0.012)
0.23 (0.009)
0.89 (0.035)
0.69 (0.027)
5.23
(0.206)
MAX.
9.02 (0.355)
8.76 (0.345)
NOTE: DIMENSIONS IN MILLIMETERS (INCHES).
20 Terminal LCCC Surface Mount, 2 Channels
8 Pin DIP Through Hole, 1 and 2 Channel
8.70 (0.342)
9.10 (0.358)
9.40 (0.370)
9.91 (0.390)
0.76 (0.030)
1.27 (0.050)
8.13 (0.320)
MAX.
4.95 (0.195)
5.21 (0.205)
1.78 (0.070)
2.03 (0.080)
7.16 (0.282)
7.57 (0.298)
1.02 (0.040) (3 PLCS)
1.14 (0.045)
1.40 (0.055)
4.32 (0.170)
MAX.
8.70 (0.342)
9.10 (0.358)
4.95 (0.195)
5.21 (0.205)
TERMINAL 1 IDENTIFIER
2.16 (0.085)
0.51 (0.020)
MIN.
3.81 (0.150)
METALIZED
CASTILLATIONS (20 PLCS)
1.78 (0.070)
2.03 (0.080)
0.20 (0.008)
0.33 (0.013)
MIN.
0.64
(0.025)
(20 PLCS)
0.51 (0.020)
1.52 (0.060)
2.03 (0.080)
7.36 (0.290)
7.87 (0.310)
2.29 (0.090)
2.79 (0.110)
0.51 (0.020)
MAX.
NOTE: DIMENSIONS IN MILLIMETERS (INCHES).
SOLDER THICKNESS 0.127 (0.005) MAX.
NOTE: DIMENSIONS IN MILLIMETERS (INCHES).
HP [ HEWLETT-PACKARD ]
