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HI-3200PQTF 参数 Datasheet PDF下载

HI-3200PQTF图片预览
型号: HI-3200PQTF
PDF下载: 下载PDF文件 查看货源
内容描述: 航空电子数据管理引擎 [AVIONICS DATA MANAGEMENT ENGINE]
分类和应用: 电子航空
文件页数/大小: 59 页 / 220 K
品牌: HOLTIC [ HOLT INTEGRATED CIRCUITS ]
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PACKAGE DIMENSIONS  
64 PIN PLASTIC QUAD FLAT PACK (PQFP)  
inches (millimeters)  
Package Type: 64PQTS  
.02  
BSC  
(0.50)  
.394  
(10.00)  
.473  
(12.00)  
BSC SQ  
BSC SQ  
.009 .002  
(0.22 .05)  
.055 .002  
(1.40 .05)  
.008  
(0.20)  
R max  
See Detail A  
.063  
(1.60)  
max  
£ Q £ 7°  
.003  
(0.08)  
R min  
.004 .002  
(0.10 .05)  
BSC = “Basic Spacing between Centers”  
is theoretical true position dimension and  
has no tolerance. (JEDEC Standard 95)  
Detail A  
64-PIN PLASTIC CHIP-SCALE PACKAGE (QFN)  
inches (millimeters)  
Package Type: 64PCS  
The metal heat sink pad on the  
bottom of the package is  
electrically isolated from the chip.  
It can be left floating or  
connected to VDD or GND  
.354  
BSC  
.27 .006  
(6.80 .15)  
(9.00)  
.0197  
BSC  
(0.50)  
.354  
(9.00)  
.27 .006  
(6.80 .15)  
BSC  
Top View  
Bottom  
View  
.010  
(0.25)  
typ  
.016 .004  
(0.40 .10)  
.008  
(0.20)  
typ  
BSC = “Basic Spacing between Centers”  
is theoretical true position dimension and  
has no tolerance. (JEDEC Standard 95)  
.039  
(1.00)  
max  
HOLT INTEGRATED CIRCUITS  
58  
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