HI-3200, HI-3201
ORDERING INFORMATION
HI-3200xx x x
PART PACKAGE
NUMBER DESCRIPTION
Blank
F
Tin / Lead (Sn / Pb) Solder
100% Matte Tin (Pb-free RoHS compliant)
PART TEMPERATURE
NUMBER RANGE
BURN
IN
FLOW
I
-40°C TO +85°C
I
No
No
T
M
-55°C TO +125°C
-55°C TO +125°C
T
M
Yes
PART PACKAGE
NUMBER DESCRIPTION
PQ
PC
64 THIN PIN PLASTIC QUAD FLAT PACK TQFP (64PQTS)
64-PIN PLASTIC CHIP-SCALE PACKAGE QFN (64PCS)
HI-3201PQ x F
PART PACKAGE
NUMBER DESCRIPTION
F
100% Matte Tin (Pb-free RoHS compliant)
PART TEMPERATURE
NUMBER RANGE
BURN
IN
FLOW
I
-40°C TO +85°C
I
No
No
T
M
-55°C TO +125°C
-55°C TO +125°C
T
M
Yes
PART PACKAGE
NUMBER DESCRIPTION
PQ
80 THIN PIN PLASTIC QUAD FLAT PACK TQFP (80PTQS)
HOLT INTEGRATED CIRCUITS
56
HOLTIC [ HOLT INTEGRATED CIRCUITS ]
