PACKAGE DIMENSIONS
inches (millimeters)
20-PIN PLASTIC SMALL OUTLINE (ESOIC) - WB
(Wide Body, Thermally Enhanced)
Package Type:
24HEW
Heat sink stud on
bottom of package.
.0105 .0015
(.2667 .0381)
.300
TYP.
.025
(.635)
.5035 .0075
(12.789 .191)
Min..
(7.620)
.4065 .0125
(10.325 .318)
.215
TYP.
Bottom
View
.296 .003
(7.518 .076)
Top View
(5.461)
.025
(.635)
SEE DETAIL A
Min..
.018
(.457)
TYP.
.090 .010
(2.286 .254)
0° to 8°
.0075 .0035
(.191 .889)
.050
(1.27)
TYP
.033 .017
(.838 .432)
DETAIL A
20-PIN CERAMIC SIDE-BRAZED DIP
PACKAGE TYPE: 20C
1.000 .010
(25.400 .254)
.310 .010
(7.874 .254)
.050 TYP.
(1.270 TYP.)
.300
(7.620
.010
.254)
.200 MAX.
(5.080 MAX.)
.085 .009
(2.159 .229)
.125 MIN.
(3.175 MIN.)
.010 +.002/- .001
(.254 +.051/- .025)
.017 .002
(.432 .051)
.100 .005
(2.540 .127)
HOLT INTEGRATED CIRCUITS
9
HOLTIC [ HOLT INTEGRATED CIRCUITS ]
