HI-1570
ORDERING INFORMATION
PART
NUMBER
IDLE
STATE
PACKAGE
DESCRIPTION
TEMPERATURE PROCESS
RANGE
BURN
IN
LEAD
FINISH
FLOW
HI-1570PSI
HI-1570PST
HI-1570PSM
0
0
0
20 PIN PLASTIC ESOIC - WB
20 PIN PLASTIC ESOIC - WB
20 PIN PLASTIC ESOIC - WB
-40°C TO +85°C
-55°C TO +125°C
-55°C TO +125°C
I
NO
NO
SOLDER
SOLDER
SOLDER
T
M
YES
HI-1570CDI
HI-1570CDT
HI-1570CDM
0
0
0
20 PIN CERAMIC SIDE BRAZED DIP
20 PIN CERAMIC SIDE BRAZED DIP
20 PIN CERAMIC SIDE BRAZED DIP
-40°C TO +85°C
-55°C TO +125°C
-55°C TO +125°C
I
NO
NO
GOLD
GOLD
T
M
YES
SOLDER
Legend: ESOIC
WB
-
-
Thermally Enhanced Small Outline Package (SOIC w/built-in heat sink)
Wide Body
HOLT INTEGRATED CIRCUITS
8