HI-1570
HEAT SINK - ESOIC PACKAGE
APPLICATIONS NOTE
The HI-1570PSI/T/M all use a 20-pin thermally enhanced
SOIC package. The package include a metal heat sink
located on the bottom surface of the device. The heat
sink should be soldered down to the printed circuit board
for optimum thermal dissipation. The heat sink is also
electrically isolated and may be soldered to any
convenient power or ground plane.
Holt Applications Note AN-500 provides circuit design
notes regarding the use of Holt's family of MIL-STD-1553
transceivers. Layout considerations, as well as
recommended interface and protection components are
included.
THERMAL CHARACTERISTICS
PACKAGE
JUNCTION TEMPERATURE
PART NUMBER
CONDITION
Heat sink
unsoldered
ØJA
DESCRIPTION
TA=25°C TA=85°C TA=125°C
20 PIN THERMALLY
54°C/W
47°C/W
66°C
61°C
126°C
121°C
166°C
161°C
HI-1570PSI
HI-1570PST
HI-1570PSM
ENHANCED PLASTIC
SOIC (ESOIC)
Heat sink
Soldered
HI-1570CDI
HI-1570CDT
HI-1570CDM
20 PIN CERAMIC
SIDE-BRAZED
Socketed
62°C/W
72°C
132°C
172°C
DIP
Data taken at VDD=5.0V, continuous transmission at 1Mbit/s, single transmitter enabled.
RECOMMENDED TRANSFORMERS
The HI-1570 transceiver has been characterized for
compliance with the electrical requirements of MIL-STD-
1553 when used with the following transformers. Holt
recommends the Premier Magnetics parts as offering the
best combination of electrical performance, low cost and
small footprint.
MANUFACTURER
PART NUMBER
APPLICATION
TURNS RATIO(S)
DIMENSIONS
Technoltrol
TL1553-45
Isolation
Dual tapped 1:1.79, 1:2.5
.630 x .630 x .155 inches
Premier Magnetics
Technoltrol
PM-DB2725EX
TQ1553-2
Isolation
Dual tapped 1:1.79, 1:2.5
.500 x .500 x .375 inches
.625 x .625 x .250 inches
.625 x .500 x .250 inches
Stub coupling
Stub coupling
1:1.4
1:1.4
Premier Magnetics
PM-DB2702
HOLT INTEGRATED CIRCUITS
7
HOLTIC [ HOLT INTEGRATED CIRCUITS ]
