欢迎访问ic37.com |
会员登录 免费注册
发布采购

HSD32M64B8A-F10 参数 Datasheet PDF下载

HSD32M64B8A-F10图片预览
型号: HSD32M64B8A-F10
PDF下载: 下载PDF文件 查看货源
内容描述: 同步DRAM模组256Mbyte ( 32Mx64Bit ) , SO -DIMM , 4Banks , 8K参考, 3.3V [Synchronous DRAM Module 256Mbyte (32Mx64Bit), SO-DIMM, 4Banks, 8K Ref., 3.3V]
分类和应用: 存储动态存储器
文件页数/大小: 11 页 / 91 K
品牌: HANBIT [ HANBIT ELECTRONICS CO.,LTD ]
 浏览型号HSD32M64B8A-F10的Datasheet PDF文件第3页浏览型号HSD32M64B8A-F10的Datasheet PDF文件第4页浏览型号HSD32M64B8A-F10的Datasheet PDF文件第5页浏览型号HSD32M64B8A-F10的Datasheet PDF文件第6页浏览型号HSD32M64B8A-F10的Datasheet PDF文件第7页浏览型号HSD32M64B8A-F10的Datasheet PDF文件第8页浏览型号HSD32M64B8A-F10的Datasheet PDF文件第10页浏览型号HSD32M64B8A-F10的Datasheet PDF文件第11页  
HANBit  
HSD32M64B8A  
SIMPLIFIED TRUTH TABLE  
CK  
/R  
A
S
/C  
A
S
D
Q
M
CKE  
n
/C  
S
/W  
E
BA  
0,1  
A10/  
AP  
A11,A12,  
A9~A0  
E
COMMAND  
NOTE  
n-1  
Register  
Refresh  
Mode register set  
Auto refresh  
H
X
H
L
L
L
L
L
L
X
OP code  
X
1,2  
3
H
L
L
H
X
Entry  
Self  
3
L
H
L
H
X
L
H
X
H
H
X
H
3
refresh  
Exit  
L
H
X
X
X
X
3
Bank active & row addr.  
H
V
V
Row address  
Auto  
Read &  
precharge  
L
Column  
Address  
(A0 ~ A9)  
4
disable  
column  
H
H
X
L
H
L
H
X
Auto  
precharge  
address  
disable  
H
4,5  
Column  
Address  
(A0 ~ A9)  
Auto  
Write &  
precharge  
precharge  
L
4
disable  
column  
X
L
H
L
L
X
V
address  
Auto  
H
4,5  
6
disable  
Burst Stop  
Precharge  
H
H
X
X
L
L
L
L
H
H
L
L
X
X
X
Bank selection  
All banks  
V
X
L
X
H
H
L
X
V
X
X
H
X
V
X
X
V
X
X
H
X
V
X
V
X
X
H
X
V
Entry  
Exit  
H
L
L
H
L
X
X
X
Clock suspend or  
active power down  
X
X
X
H
L
Entry  
H
Precharge power  
down mode  
H
L
Exit  
L
H
H
H
X
X
V
X
DQM  
X
X
7
H
L
X
X
X
H
No operation command  
H
H
(V=Valid, X=Don't care, H=Logic high, L=Logic low)  
Notes :  
1. OP Code : Operand code  
A0 ~ A12 & BA0 ~ BA1 : Program keys. (@ MRS)  
2. MRS can be issued only at all banks precharge state.  
A new command can be issued after 2 CLK cycles of MRS.  
3. Auto refresh functions are as same as CBR refresh of DRAM.  
The automatical precharge without row precharge command is meant by "Auto".  
Auto/self refresh can be issued only at all banks precharge state.  
4. BA0 ~ BA1 : Bank select addresses.  
If both BA0 and BA1 are "Low" at read, write, row active and precharge, bank A is selected.  
If both BA0 is "Low" and BA1 is "High" at read, write, row active and precharge, bank B is selected.  
If both BA0 is "High" and BA1 is "Low" at read, write, row active and precharge, bank C is selected.  
If both BA0 and BA1 are "High" at read, write, row active and precharge, bank D is selected.  
If A10/AP is "High" at row precharge, BA0 and BA1 is ignored and all banks are selected.  
5. During burst read or write with auto precharge, new read/write command can not be issued.  
Another bank read/write command can be issued after the end of burst.  
New row active of the associated bank can be issued at tRP after the end of burst.  
6. Burst stop command is valid at every burst length.  
7. DQM sampled at positive going edge of a CLK and masks the data-in at the very CLK (Write DQM latency is 0),  
but makes Hi-Z state the data-out of 2 CLK cycles after. (Read DQM latency is 2)  
URL:www.hbe.co.kr  
REV.1.0(August.2002)  
HANBit Electronics Co.,Ltd.  
9