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HSD32M64B8A-F10 参数 Datasheet PDF下载

HSD32M64B8A-F10图片预览
型号: HSD32M64B8A-F10
PDF下载: 下载PDF文件 查看货源
内容描述: 同步DRAM模组256Mbyte ( 32Mx64Bit ) , SO -DIMM , 4Banks , 8K参考, 3.3V [Synchronous DRAM Module 256Mbyte (32Mx64Bit), SO-DIMM, 4Banks, 8K Ref., 3.3V]
分类和应用: 存储动态存储器
文件页数/大小: 11 页 / 91 K
品牌: HANBIT [ HANBIT ELECTRONICS CO.,LTD ]
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HANBit  
HSD32M64B8A  
+3.3V  
V =1.4V  
tt  
1200W  
50pF*  
50W  
DOUT  
DOUT  
Z0=50W  
870W  
50pF  
V
V
(DC) = 2.4V, I = -2mA  
OH  
OH  
(DC) = 0.4V, I = 2mA  
OL  
OL  
(Fig. 2) AC output load circuit  
(Fig. 1) DC output load circuit  
OPERATING AC PARAMETER  
(AC operating conditions unless otherwise noted)  
VERSION  
PARAMETER  
SYMBOL  
UNIT  
NOTE  
-13  
15  
20  
20  
45  
-12  
-10  
20  
20  
20  
50  
-10L  
20  
Row active to row active delay  
RAS to CAS delay  
tRRD(min)  
tRP(min)  
16  
20  
20  
48  
ns  
ns  
ns  
ns  
1
1
1
1
20  
Row precharge time  
tRP(min)  
20  
tRAS(min)  
tRAS(max)  
50  
Row active time  
100  
2
ns  
Row cycle time  
tRC(min)  
tRDL(min)  
tDAL(min)  
tCDL(min)  
tBDL(min)  
tCCD(min)  
65  
68  
70  
70  
ns  
CLK  
-
1
2.5  
5
Last data in to row precharge  
Last data in to Active delay  
Last data in to new col. address delay  
Last data in to burst stop  
2 CLK + 20 ns  
1
1
1
2
CLK  
CLK  
CLK  
2
2
Col. address to col. address delay  
3
CAS latency=3  
CAS latency=2  
Number of valid output data  
ea  
4
-
1
Notes :  
1. The minimum number of clock cycles is determined by dividing the minimum time required with clock cycle time and  
then rounding off to the next higher integer.  
2. Minimum delay is required to complete write.  
3. All parts allow every cycle column address change.  
4. In case of row precharge interrupt, auto precharge and read burst stop.  
5. For -8/H/L, tRDL=1CLK and tDAL=1CLK+20ns is also supported .  
(Recommand : tRDL=2CLK and tDAL=2CLK & 20ns.)  
URL:www.hbe.co.kr  
REV.1.0(August.2002)  
HANBit Electronics Co.,Ltd.  
7