Preliminary
GS84018/32/36AT/B-180/166/150/100
TQFP Package Drawing
θ
L
c
L1
Symbol
Description
Standoff
Min. Nom. Max
A1
A2
b
0.05
1.35
0.20
0.09
0.10
1.40
0.30
0.15
1.45
0.40
0.20
22.1
20.1
16.1
14.1
Body Thickness
Lead Width
c
Lead Thickness
D
Terminal Dimension 21.9
Package Body 19.9
Terminal Dimension 15.9
22.0
20.0
16.0
14.0
0.65
0.60
1.00
e
D1
E
b
E1
e
Package Body
Lead Pitch
13.9
L
Foot Length
Lead Length
Coplanarity
Lead Angle
0.45
0.75
L1
Y
A1
A2
E1
E
0.10
θ
0°
7°
Notes:
1. All dimensions are in millimeters (mm).
2. Package width and length do not include mold protrusion.
Rev: 1.12 7/2002
27/31
© 1999, Giga Semiconductor, Inc.
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com
GSI [ GSI TECHNOLOGY ]
