GS4576C09/18/36L
Recommended Operating Temperature and Thermal Impedance
Like any other semiconcuctor device, the LLDRAM II must be operated within the temperature specifications shown in the
Temperature Limits table for the device to meet datasheet specifications. The thermal impedance characteristics of the device are
are listed below. In applications where the ambient temperature or PCB temperature are too high, use of forced air and/or heat
sinks may be required in order to satisfy the case temperature specifications.
Temperature Limits
Temperature
Parameter
Symbol
Min.
Max.
Unit
Notes
Range
Commercial
Industrial
0
+100
+100
+95
C°
C°
C°
C°
1
1
T
Operating junction temperature
J
–40
0
Commercial
Industrial
2, 3
2, 3, 4
T
Operating case temperature
C
–40
+95
Notes:
1. Junction temperature depends upon package type, cycle time, loading, ambient temperature, and airflow.
2. Maximum operating case temperature, T , is measured in the center of the package.
C
3. Device functionality is not guaranteed if the device exceeds maximum T during operation.
C
4. Junction and case temperature specifications must be satisfied.
Thermal Impedance
Test PCB
Substrate
JA (C°/W)
Airflow = 0 m/s
JA (C°/W)
Airflow = 1 m/s
JA (C°/W)
Airflow = 2 m/s
JB (C°/W)
JC (C°/W)
Package
2-layer
4-layer
TBD
22.4
TBD
19.0
TBD
16.2
TBD
5.3
TBD
1.7
BGA
Notes:
1. Thermal Impedance data is based on a number of of samples from mulitple lots and should be viewed as a typical number.
2. Please refer to JEDEC standard JESD51-6.
3. The characteristics of the test fixture PCB influence reported thermal characteristics of the device. The minimal metalization of a 2-layer
board tends to minimize the utility of the junction-to-board heat path. The 4-layer test fixture PCB is intended to highlight the effect of
connection to power planes typically found in the PCBs used in most applications. Be advised that a good thermal path to the PCB can
result in cooling or heating of the RAM depending on PCB temperature.
Rev: 1.04 11/2013
38/62
© 2011, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GSI [ GSI TECHNOLOGY ]
