GS9090 Data Sheet
2.4 Solder Reflow Profiles
The device is manufactured with Matte-Sn terminations and is compatible with both
standard eutectic and Pb-free solder reflow profiles. MSL qualification was
performed using the maximum Pb-free reflow profile shown in Figure 2-2. The
recommended standard eutectic reflow profile is shown in Figure 2-3.
Temperature
60-150 sec.
20-40 sec.
260˚C
250˚C
3˚C/sec max
217˚C
6˚C/sec max
200˚C
150˚C
25˚C
Time
60-180 sec. max
8 min. max
Figure 2-2: Maximum Pb-free Solder Reflow Profile (Preferred)
60-150 sec.
Temperature
10-20 sec.
230˚C
220˚C
3˚C/sec max
183˚C
6˚C/sec max
150˚C
100˚C
25˚C
Time
120 sec. max
6 min. max
Figure 2-3: Standard Eutectic Solder Reflow Profile (Pb-free package)
28201 - 1 July 2005
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GENNUM [ GENNUM CORPORATION ]
