GS1574A Data Sheet
6.2 Recommended PCB Footprint
0.35
0.65
0.55
3.70
2.76
CENTER PAD
NOTE:All dimensions
are in millimeters.
2.76
3.70
The Center Pad should be connected to the most negative power supply plane for
analog circuitry in the device (VEE_A) by a minimum of 5 vias.
Note: Suggested dimensions only. Final dimensions should conform to customer
design rules and process optimizations.
6.3 Packaging Data
Parameter
Value
Package Type
4mm x 4mm 16-pin QFN
Package Drawing Reference
Moisture Sensitivity Level
Junction to Case Thermal Resistance, θj-c
JEDEC M0220
3
31.0°C/W
Junction to Air Thermal Resistance, θj-a (at zero airflow)
43.8°C/W
Psi
11.0°C/W
Yes
Pb-free and RoHS compliant
6.4 Ordering Information
Part Number
Package
Temperature Range
GS1574A
GS1574ACNE3
16-pin QFN
0°C to 70°C
33416 - 5 March 2006
15 of 16
GENNUM [ GENNUM CORPORATION ]
