7.2 Solder Reflow Profiles
The GS1559 is available in a Pb or Pb-free package. It is recommended that the Pb
package be soldered with Pb paste using the Standard Eutectic profile shown in
Figure 7-1, and the Pb-free package be soldered with Pb-free paste using the reflow
profile shown in Figure 7-2.
NOTE: It is possible to solder a Pb-free package with Pb paste using a Standard Eutectic
o
o
profile with a reflow temperature maintained at 245 C – 250 C.
60-150 sec.
Temperature
10-20 sec.
230°C
220°C
3°C/sec max
183°C
6°C/sec max
150°C
100°C
25°C
Time
120 sec. max
6 min. max
Figure 7-1: Standard Eutectic Solder Reflow Profile (Pb package, Pb paste)
Temperature
60-150 sec.
20-40 sec.
260°C
250°C
3°C/sec max
217°C
6°C/sec max
200°C
150°C
25°C
Time
60-180 sec. max
8 min. max
Figure 7-2: Maximum Pb-free Solder Reflow Profile (Pb-free package, Pb-free
paste)
GS1559 HD-LINX™ II Multi-Rate Deserializer with
Loop-Through Cable Driver
Data Sheet
69 of 71
30572 - 8
July 2008
GENNUM [ GENNUM CORPORATION ]
