Thermal
Table 75. Example Clock Frequency Combinations (continued)
eLBC
1
Ref
1
LBCM DDRCM SVCOD SPMF
48.0
66.7
25.0
33.3
50.0
50.0
66.7
66.7
66.7
1
e300 Core
1
/8
18
16.7
25
33.3
25
50
33.3
×
1
—
—
—
—
—
—
—
333
400
×
1.5
—
—
—
400
—
600
400
500
600
×
2
—
—
400
533
400
800
533
667
800
×
2.5
360
333
500
667
500
—
667
—
—
×
3
432
400
600
800
600
—
800
—
—
Sys
DDR data
CSB
1
,3
VCO
1,
2
rate
1,
4
576
533
800
533
800
800
533
667
800
144
133
200
266.7
200
400
266.7
333
400
288
266
200
267
200
400
267
333
400
/2
72
6
66.7
100
6
133
6
100
6
—
133
6
—
—
/4
36
33.3
50
66.7
50
100
6
66.7
0
0
0
0
0
0
0
0
0
1
1
0
0
0
0
0
0
0
2
2
4
2
4
2
2
2
2
3
2
8
8
4
8
4
5
6
83.3
6
41.6
100
6
50
Note:
Values in MHz.
2
System PLL VCO range: 400–800 MHz.
3
CSB frequencies less than 133 MHz will not support Gigabit Ethernet rates.
4
Minimum data rate for DDR2 is 250 MHz and for DDR1 is 167 MHz.
5
Applies to DDR2 only.
6
Applies to eLBC PLL-enabled mode only.
23 Thermal
This section describes the thermal specifications of the MPC8378E.
23.1
Thermal Characteristics
Table 76. Package Thermal Characteristics for TePBGA II
Parameter
Symbol
R
θJA
R
θJA
R
θJMA
R
θJMA
R
θJB
R
θJC
Value
21
15
16
12
8
6
Unit
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Notes
provides the package thermal characteristics for the 689 31
×
31mm TePBGA II package.
Junction-to-ambient natural convection on single layer board (1s)
Junction-to-ambient natural convection on four layer board (2s2p)
Junction-to-ambient (at 200 ft/min) on single layer board (1s)
Junction-to-ambient (at 200 ft/min) on four layer board (2s2p)
Junction-to-board thermal
Junction-to-case thermal
MPC8378E PowerQUICC
™
II Pro Processor Hardware Specifications, Rev. 2
Freescale Semiconductor
113
FREESCALE [ FREESCALE SEMICONDUCTOR, INC ]
