Nonswitching electrical specifications
Table 5. Supply current characteristics (continued)
C
Parameter
Symbol
Bus Freq
VDD (V)
Typical1
Max
Unit
Temp
ADLSMP = 1
42 (32-pin
package)
ADCO = 1
MODE = 10B
ADICLK = 11B
C
3
82 (64-, 44-
pin
packages)
—
41 (32-pin
package)
C
C
LVD adder to stop4
—
—
5
3
128
124
—
—
µA
–40 to 105 °C
1. Data in Typical column was characterized at 5.0 V, 25 °C or is typical recommended value.
2. RTC adder causes IDD to increase typically by less than 1 µA; RTC clock source is 1 kHz LPO clock.
3. ACMP adder causes IDD to increase typically by less than 1 µA.
4. LVD is periodically woken up from Stop by 5% duty cycle. The period is equal to or less than 2 ms.
5.1.3 EMC performance
Electromagnetic compatibility (EMC) performance is highly dependent on the
environment in which the MCU resides. Board design and layout, circuit topology
choices, location and characteristics of external components as well as MCU software
operation play a significant role in EMC performance. The system designer must consult
the following Freescale applications notes, available on freescale.com for advice and
guidance specifically targeted at optimizing EMC performance.
• AN2321: Designing for Board Level Electromagnetic Compatibility
• AN1050: Designing for Electromagnetic Compatibility (EMC) with HCMOS
Microcontrollers
• AN1263: Designing for Electromagnetic Compatibility with Single-Chip
Microcontrollers
• AN2764: Improving the Transient Immunity Performance of Microcontroller-Based
Applications
• AN1259: System Design and Layout Techniques for Noise Reduction in MCU-
Based Systems
KE02 Sub-Family Data Sheet, Rev3, 07/2013.
Freescale Semiconductor, Inc.
15
FREESCALE [ Freescale ]
