General
2. VDD = 3.3 V, TA = 25 °C, fOSC = 12 MHz (crystal), fSYS = 96 MHz, fBUS = 48 MHz
3. Specified according to Annex D of IEC Standard 61967-2, Measurement of Radiated Emissions—TEM Cell and Wideband
TEM Cell Method
5.2.7 Designing with radiated emissions in mind
To find application notes that provide guidance on designing your system to minimize
interference from radiated emissions:
1. Go to http://www.freescale.com.
2. Perform a keyword search for “EMC design.”
5.2.8 Capacitance attributes
Table 8. Capacitance attributes
Symbol
Description
Min.
Max.
Unit
CIN_A
Input capacitance: analog pins
—
7
pF
CIN_D
Input capacitance: digital pins
—
7
pF
5.3 Switching specifications
5.3.1 Device clock specifications
Table 9. Device clock specifications
Symbol
Description
Min.
Max.
Unit
Notes
Normal run mode
fSYS
System and core clock
—
100
—
MHz
MHz
fSYS_USB
System and core clock when Full Speed USB in
operation
20
fENET
System and core clock when ethernet in operation
—
MHz
5
• 10 Mbps
• 100 Mbps
50
fBUS
FB_CLK
fFLASH
Bus clock
—
—
—
—
50
50
25
25
MHz
MHz
MHz
MHz
FlexBus clock
Flash clock
LPTMR clock
fLPTMR
K60 Sub-Family Data Sheet Data Sheet, Rev. 6, 9/2011.
20
Freescale Semiconductor, Inc.