Electrical Characteristics
Table 10. Thermal Characteristics (continued)
Characteristic
Symbol
Value
Unit
100 LQFP Junction to ambient, natural convection
Single layer board (1s)
θJA
θJA
θJMA
θJMA
θJB
θJC
Ψjt
5313,14
391,15
421,3
331,3
2516
917
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
oC
Junction to ambient, natural convection
Junction to ambient, (@200 ft/min)
Junction to ambient, (@200 ft/min)
Junction to board
Four layer board (2s2p)
Single layer board (1s)
Four layer board (2s2p)
—
Junction to case
—
Natural convection
—
Junction to top of package
218
Maximum operating junction temperature
Tj
105
1
θ
JA and Ψjt parameters are simulated in conformance with EIA/JESD Standard 51-2 for natural convection. Freescale
recommends the use of θJA and power dissipation specifications in the system design to prevent device junction
temperatures from exceeding the rated specification. System designers should be aware that device junction temperatures
can be significantly influenced by board layout and surrounding devices. Conformance to the device junction temperature
specification can be verified by physical measurement in the customer’s system using the Ψjt parameter, the device power
dissipation, and the method described in EIA/JESD Standard 51-2.
2
3
4
Per JEDEC JESD51-2 with the single-layer board (JESD51-3) horizontal.
Per JEDEC JESD51-6 with the board JESD51-7) horizontal.
Thermal resistance between the die and the printed circuit board in conformance with JEDEC JESD51-8. Board
temperature is measured on the top surface of the board near the package.
5
6
Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883
Method 1012.1).
Thermal characterization parameter indicating the temperature difference between package top and the junction
temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is written
in conformance with Psi-JT.
7
θ
JA and Ψjt parameters are simulated in conformance with EIA/JESD Standard 51-2 for natural convection. Freescale
recommends the use of θJA and power dissipation specifications in the system design to prevent device junction
temperatures from exceeding the rated specification. System designers should be aware that device junction temperatures
can be significantly influenced by board layout and surrounding devices. Conformance to the device junction temperature
specification can be verified by physical measurement in the customer’s system using the Ψjt parameter, the device power
dissipation, and the method described in EIA/JESD Standard 51-2.
8
9
Per JEDEC JESD51-2 with the single-layer board (JESD51-3) horizontal.
Per JEDEC JESD51-6 with the board JESD51-7) horizontal.
10 Thermal resistance between the die and the printed circuit board in conformance with JEDEC JESD51-8. Board
temperature is measured on the top surface of the board near the package.
11 Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883
Method 1012.1).
12 Thermal characterization parameter indicating the temperature difference between package top and the junction
temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is written
in conformance with Psi-JT.
13 θJA and Ψjt parameters are simulated in conformance with EIA/JESD Standard 51-2 for natural convection. Freescale
recommends the use of θJA and power dissipation specifications in the system design to prevent device junction
temperatures from exceeding the rated specification. System designers should be aware that device junction temperatures
can be significantly influenced by board layout and surrounding devices. Conformance to the device junction temperature
specification can be verified by physical measurement in the customer’s system using the Ψjt parameter, the device power
dissipation, and the method described in EIA/JESD Standard 51-2.
14 Per JEDEC JESD51-2 with the single-layer board (JESD51-3) horizontal.
15 Per JEDEC JESD51-6 with the board JESD51-7) horizontal.
MCF52259 ColdFire Microcontroller, Rev. 0
Freescale Semiconductor
31
FREESCALE [ Freescale ]
