Thermal specifications
The following general purpose specifications apply to all signals configured for RGPIO,
FTM, and UART. The conditions are 25 pf load, VDD = 3.6 V to 1.71 V, and full
temperature range. The GPIO are set for high drive, no slew rate control, and no input
filter, digital or analog, unless otherwise specified.
Table 10. RGPIO General Control Timing
Symbol
R1
Description
Min.
Max.
Unit
CPUCLK from CLK_OUT pin high to GPIO output valid
—
1
16
—
ns
ns
R2
CPUCLK from CLK_OUT pin high to GPIO output invalid
(output hold)
R3
R4
GPIO input valid to bus clock high
17
—
—
2
ns
ns
CPUCLK from CLK_OUT pin high to GPIO input invalid
Bus clock
R1
R2
Data outputs
R3
R4
Data inputs
Figure 4. RGPIO timing diagram
5.4 Thermal specifications
5.4.1 Thermal operating requirements
Table 11. Thermal operating requirements
Symbol
Description
Min.
Max.
Unit
TJ
Die junction temperature
–40
115
105
°C
TA
Ambient temperature
–40
°C
MCF51JU128 Data Sheet, Rev. 4, 01/2012.
20
Freescale Semiconductor, Inc.