Mechanical Specifications
23.2 48-Pin Low-Profile Quad Flat Pack (LQFP)
4X
NOTES:
0.200 AB T–U
Z
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE AB IS LOCATED AT BOTTOM OF
LEAD AND IS COINCIDENT WITH THE LEAD
WHERE THE LEAD EXITS THE PLASTIC BODY AT
THE BOTTOM OF THE PARTING LINE.
4. DATUMS T, U, AND Z TO BE DETERMINED AT
DATUM PLANE AB.
DETAIL Y
9
A
P
A1
48
37
5. DIMENSIONS S AND V TO BE DETERMINED AT
SEATING PLANE AC.
1
36
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE PROTRUSION IS
0.250 PER SIDE. DIMENSIONS A AND B DO
INCLUDE MOLD MISMATCH AND ARE
DETERMINED AT DATUM PLANE AB.
7. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. DAMBAR PROTRUSION SHALL
NOT CAUSE THE D DIMENSION TO EXCEED
0.350.
T
U
B
V
AE
AE
B1
V1
8. MINIMUM SOLDER PLATE THICKNESS SHALL BE
0.0076.
12
25
9. EXACT SHAPE OF EACH CORNER IS OPTIONAL.
MILLIMETERS
13
24
DIM
A
MIN
MAX
Z
7.000 BSC
A1
B
B1
C
D
E
3.500 BSC
7.000 BSC
3.500 BSC
S1
T, U, Z
1.400
1.600
0.270
1.450
0.230
S
0.170
1.350
0.170
DETAIL Y
4X
F
G
0.200 AC T–U
Z
0.500 BSC
H
J
K
L
M
N
0.050
0.090
0.500
1°
0.150
0.200
0.700
5°
0.080 AC
12° REF
G
AB
AC
0.090
0.160
P
0.250 BSC
R
0.150
0.250
S
9.000 BSC
S1
V
V1
W
AA
4.500 BSC
9.000 BSC
4.500 BSC
0.200 REF
1.000 REF
AD
°
M
BASE METAL
TOP & BOTTOM
R
N
J
E
C
H
F
D
M
0.080
AC T–U Z
SECTION AE–AE
W
°
L
K
DETAIL AD
AA
Figure 23-1. 48-Pin LQFP (Case #932)
MC68HC908AP Family Data Sheet, Rev. 4
316
Freescale Semiconductor
FREESCALE [ Freescale ]
