Mechanical Specifications
23.4 42-Pin Shrink Dual In-Line Package (SDIP)
NOTES:
–A–
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSIONS A AND B DO NOT INCLUDE MOLD
FLASH. MAXIMUM MOLD FLASH 0.25 (0.010).
42
1
22
21
–B–
INCHES
MILLIMETERS
DIM
A
B
C
D
F
MIN
MAX
1.465
0.560
0.200
0.022
0.046
MIN
36.45
13.72
3.94
0.36
0.81
MAX
37.21
14.22
5.08
0.56
1.17
L
1.435
0.540
0.155
0.014
0.032
H
C
K
G
H
J
K
L
0.070 BSC
0.300 BSC
1.778 BSC
7.62 BSC
0.008
0.115
0.015
0.135
0.20
2.92
0.38
3.43
–T–
SEATING
PLANE
0.600 BSC
15.24 BSC
N
G
M
N
0°
0.020
15°
0.040
0 °
0.51
15°
1.02
M
F
J 42 PL
D 42 PL
M
S
0.25 (0.010)
T B
M
S
0.25 (0.010)
T A
Figure 23-3. 42-Pin SDIP (Case #858)
MC68HC908AP Family Data Sheet, Rev. 4
318
Freescale Semiconductor