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MC34701R2 参数 Datasheet PDF下载

MC34701R2图片预览
型号: MC34701R2
PDF下载: 下载PDF文件 查看货源
内容描述: 1.5 A开关模式电源与线性稳压器 [1.5 A Switch-Mode Power Supply with Linear Regulator]
分类和应用: 稳压器开关
文件页数/大小: 38 页 / 739 K
品牌: FREESCALE [ Freescale ]
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MAXIMUM RATINGS  
MAXIMUM RATINGS  
Table 2. Maximum Ratings  
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or permanent  
damage to the device.  
Rating  
Symbol  
Value  
Unit  
Electrical Ratings  
Supply Voltage  
V
V
, V  
-0.3 to 7.0  
-1.0 to 7.0  
-0.3 to 8.5  
-0.3 to 8.5  
-0.3 to 9.5  
-0.3 to 7.0  
-0.3 to 7.0  
-0.3 to 7.0  
V
V
V
V
V
V
V
V
V
IN1 IN2  
Switching Node Voltage  
V
SW  
IN(BOOT)  
Buck Regulator Bootstrap Input Voltage (BOOT - SW)  
Boost Regulator Output Voltage  
Boost Regulator Drain Voltage  
V
BST  
V
BD  
RST Drain Voltage  
V
RST  
Enable Terminal Voltage at EN1, EN2  
Logic Terminal Voltage at SDA, SCL  
V
EN  
V
LOG  
Analog Terminal Voltage  
LDO, VOUT, RST  
-0.3 to 7.0  
-0.3 to 8.5  
V
OUT  
LDRV, LCMP, CS  
V
LIN  
Terminal Voltage at CLKSEL, ADDR, RT, FREQ, VDDI, CLKSYN, INV,  
LFB  
-0.3 to 3.6  
V
V
V
LOGIC  
ESD Voltage (1)  
Human Body Model  
Machine Model  
±2000  
±200  
V
ESD  
Thermal Ratings  
Storage Temperature  
T
-65 to 150  
260  
°C  
°C  
STG  
Lead Soldering Temperature (2)  
Maximum Junction Temperature  
T
SOLDER  
T
125  
°C  
JMAX  
Thermal Resistance  
R
°C/W  
θJA  
(4)  
Junction to Ambient (Single Layer) (3)  
,
70  
55  
(4)  
Junction to Ambient (Four Layers) (3)  
,
Thermal Resistance, Junction to Base (5)  
R
18  
°C/W  
θJB  
Operational Package Temperature (Ambient Temperature)  
Notes  
T
-40 to 85  
°C  
A
1. ESD1 testing is performed in accordance with the Human Body Model (CZAP=100 pF, RZAP=1500 ), ESD2 testing is performed in  
accordance with the Machine Model (CZAP=200 pF, RZAP=0 ), and the Charge Device Model.  
2. Lead soldering temperature limit is for 10 seconds maximum duration.  
3. Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board) temperature,  
ambient temperature, air flow, power dissipation of other components on the board and board thermal resistance.  
4. Per JEDEC JESD51-6 with the board horizontal  
5. Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on the top  
surface of the board near the package.  
34701  
Analog Integrated Circuit Device Data  
Freescale Semiconductor  
5
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