ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
Table 3. Maximum Ratings (continued)
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or
permanent damage to the device.
Ratings
Symbol
Value
Unit
THERMAL RESISTANCE
RTH, RTL Termination Resistance
RRTHRTL
RAJC
500 to 16 k
3.1
Ω
Junction to Heatsink Thermal Resistance for HSOP-20
33% Power on V1, 66% on V2 (including CAN) (2)
Junction to Pin Thermal Resistance for SO-28WD (3)
Thermal Shutdown Temperature
°C/W
RAS/P
TSD
17
°C/W
165
°C
(5)
Peak Package Reflow Temperature During Reflow (4)
,
TPPRT
Note 5
°C
Notes
2. Refer to thermal management in device description section.
3. Refer to thermal management in device section. Ground pins 6, 7, 8, 9, 20, 21, 22, and 23 of SO28WB package.
4. Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
5. Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow
Temperature and Moisture Sensitivity Levels (MSL),
Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes and enter the core ID to view all orderable parts. (i.e.
MC33xxxD enter 33xxx), and review parametrics.
33389
Analog Integrated Circuit Device Data
Freescale Semiconductor
7
FREESCALE [ Freescale ]
