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KMPC875ZT133 参数 Datasheet PDF下载

KMPC875ZT133图片预览
型号: KMPC875ZT133
PDF下载: 下载PDF文件 查看货源
内容描述: 硬件规格 [Hardware Specifications]
分类和应用:
文件页数/大小: 84 页 / 1372 K
品牌: FREESCALE [ Freescale ]
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Thermal Calculation and Measurement  
4 Input capacitance is periodically sampled.  
5 A(0:31), TSIZ0/REG, TSIZ1, D(0:31), IRQ(2:4), IRQ6, RD/WR, BURST, IP_B(0:1), PA(0:4), PA(6:7), PA(10:11), PA15,  
PB19, PB(23:31), PC(6:7), PC(10:13), PC15, PD8, PE(14:31), MII1_CRS, MII_MDIO, MII1_TXEN, MII1_COL.  
6 BDIP/GPL_B(5), BR, BG, FRZ/IRQ6, CS(0:7), WE(0:3), BS_A(0:3), GPL_A0/GPL_B0, OE/GPL_A1/GPL_B1,  
GPL_A(2:3)/GPL_B(2:3)/CS(2:3), UPWAITA/GPL_A4, UPWAITB/GPL_B4, GPL_A5, ALE_A, CE1_A, CE2_A,  
OP(0:3) BADDR(28:30  
7 Thermal Calculation and Measurement  
For the following discussions, P = (VDDL × I  
) + P , where P is the power dissipation of the I/O  
D
DDL  
I/O I/O  
drivers.  
NOTE  
power dissipation is negligible.  
The V  
DDSYN  
7.1 Estimation with Junction-to-Ambient Thermal Resistance  
An estimation of the chip junction temperature, TJ, in °C can be obtained from the following equation:  
T = T + (R  
× P )  
D
J
A
θJA  
where:  
T = ambient temperature ºC  
A
R
= package junction-to-ambient thermal resistance (ºC/W)  
θJA  
P = power dissipation in package  
D
The junction-to-ambient thermal resistance is an industry standard value that provides a quick and easy  
estimation of thermal performance. However, the answer is only an estimate; test cases have demonstrated  
that errors of a factor of two (in the quantity T –T ) are possible.  
J
A
7.2 Estimation with Junction-to-Case Thermal Resistance  
Historically, thermal resistance has frequently been expressed as the sum of a junction-to-case thermal  
resistance and a case-to-ambient thermal resistance:  
R
= R  
+ R  
θJC θCA  
θJA  
where:  
R
R
R
= junction-to-ambient thermal resistance (ºC/W)  
= junction-to-case thermal resistance (ºC/W)  
= case-to-ambient thermal resistance (ºC/W)  
θJA  
θJC  
θCA  
R
is device-related and cannot be influenced by the user. The user adjusts the thermal environment to  
θJC  
affect the case-to-ambient thermal resistance, R  
. For instance, the user can change the airflow around  
θCA  
the device, add a heat sink, change the mounting arrangement on the printed circuit board, or change the  
thermal dissipation on the printed circuit board surrounding the device. This thermal model is most useful  
for ceramic packages with heat sinks where some 90% of the heat flows through the case and the heat sink  
to the ambient environment. For most packages, a better model is required.  
MPC875/MPC870 Hardware Specifications, Rev. 3.0  
Freescale Semiconductor  
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE  
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