欢迎访问ic37.com |
会员登录 免费注册
发布采购

DSPA56371 参数 Datasheet PDF下载

DSPA56371图片预览
型号: DSPA56371
PDF下载: 下载PDF文件 查看货源
内容描述: 该DSP56371是5.0伏兼容的输入和输出的高密度CMOS器件。 [The DSP56371 is a high density CMOS device with 5.0-volt compatible inputs and outputs.]
分类和应用:
文件页数/大小: 124 页 / 1701 K
品牌: FREESCALE [ Freescale ]
 浏览型号DSPA56371的Datasheet PDF文件第2页浏览型号DSPA56371的Datasheet PDF文件第3页浏览型号DSPA56371的Datasheet PDF文件第4页浏览型号DSPA56371的Datasheet PDF文件第5页浏览型号DSPA56371的Datasheet PDF文件第7页浏览型号DSPA56371的Datasheet PDF文件第8页浏览型号DSPA56371的Datasheet PDF文件第9页浏览型号DSPA56371的Datasheet PDF文件第10页  
DSP56371 Overview  
2.4.4  
Internal Buses  
To provide data exchange between blocks, the following buses are implemented:  
Peripheral input/output expansion bus (PIO_EB) to peripherals  
Program memory expansion bus (PM_EB) to program memory  
X memory expansion bus (XM_EB) to X memory  
Y memory expansion bus (YM_EB) to Y memory  
Global data bus (GDB) between registers in the DMA, AGU, OnCE, PLL, BIU and PCU, as well as the memory-mapped  
registers in the peripherals  
DMA data bus (DDB) for carrying DMA data between memories and/or peripherals  
DMA address bus (DAB) for carrying DMA addresses to memories and peripherals  
Program Data Bus (PDB) for carrying program data throughout the core  
X memory Data Bus (XDB) for carrying X data throughout the core  
Y memory Data Bus (YDB) for carrying Y data throughout the core  
Program address bus (PAB) for carrying program memory addresses throughout the core  
X memory address bus (XAB) for carrying X memory addresses throughout the core  
Y memory address bus (YAB) for carrying Y memory addresses throughout the core  
All internal buses on the DSP56300 family members are 24-bit buses. See Figure 1.  
2.4.5  
Direct Memory Access (DMA)  
The DMA block has the following features:  
Six DMA channels supporting internal and external accesses  
One-, two- and three-dimensional transfers (including circular buffering)  
End-of-block-transfer interrupts  
Triggering from interrupt lines and all peripherals  
2.4.6  
PLL-based Clock Oscillator  
The clock generator in the DSP56300 core is composed of two main blocks: the PLL, which performs clock input division,  
frequency multiplication, skew elimination and the clock generator (CLKGEN), which performs low-power division and clock pulse  
generation. PLL-based clocking:  
Allows change of low-power divide factor (DF) without loss of lock  
Provides output clock with skew elimination  
Provides a wide range of frequency multiplications (1 to 255), predivider factors (1 to 31), PLL feedback multiplier (2 or  
4), Output divide factor (1, 2 or 4) and a power-saving clock divider (2i: i = 0 to 7) to reduce clock noise  
The PLL allows the processor to operate at a high internal clock frequency using a low frequency clock input. This feature offers  
two immediate benefits:  
A lower frequency clock input reduces the overall electromagnetic interference generated by a system.  
The ability to oscillate at different frequencies reduces costs by eliminating the need to add additional oscillators to a  
system.  
NOTE  
The PLL will momentarily overshoot the target frequency when the PLL is first enabled or  
when the VCO frequency is modified. It is important that when modifying the PLL frequency  
or enabling the PLL that the two step procedure defined in Section 3, DSP56371 Overview  
be followed.  
2.4.7  
On-Chip Memory  
The memory space of the DSP56300 core is partitioned into program memory space, X data memory space and Y data memory  
space. The data memory space is divided into X and Y data memory in order to work with the two Address ALUs and to feed two  
operands simultaneously to the Data ALU. Memory space includes internal RAM and ROM and can not be expanded off-chip.  
There is an instruction patch module. The patch module is used to patch program ROM. The memory switch mode is used to  
increase the size of program RAM as needed (switch from X data RAM and/or Y data RAM).  
6
DSP56371 Technical Data  
Freescale Semiconductor  
 复制成功!