Power and Thermal Characteristics
75
Power and Thermal
Characteristics
Table 36 provides the derived power and thermal characteristics for the production
version of the C-3e NP.
Table 36 C-3e Network Processor Power and Thermal Characteristics
PARAMETER
MIN
TYP
MAX
UNITS TEST CONDITIONS
Power Dissipation, PD
2.5
5.5
7.5
W
180MHz core clock
See Note below
Maximum Junction
Temperature, TJ
125
oC
See Note below
See Note below
See Note below
Thermal Resistance, junction
to case, θJC
<0.1
5.5
oC/W
oC/W
Thermal Resistance, junction
to printed circuit board, θJB
Table 36 note: Power dissipation values assume the following conditions:
• BMU memory operating at 125MHz
• TLU memory operating at 125MHz
• QMU operating at 150MHz
• VDD = 1.1V, VDD33/VDDT = 3.3V, TJ at approximately 50°C for typical values. VDD and
VDD33/VDDT are 5% higher for maximum values
• “Minimum” PD based on idle condition (clocks running and no programs executing)
• “Typical” PD based on test application that implements Fast Ethernet forwarding
actively running on all CPs
• “Maximum” PD based on maximum consumption for any high-bandwidth
communications application executing on all CPs, FP, and XP
Thermal Management This section provides thermal management information for the ceramic ball grid array
Information
(CBGA) package for air-cooled applications. Proper thermal control design is primarily
dependent on the system-level design—the heat sink, airflow, and thermal interface
material. To reduce the die-junction temperature, heat sinks may be attached to the
package by several methods—spring clip to holes in the printed-circuit board or package,
and mounting clip and screw assembly (refer to Figure 10); however, due to the potential
03
FREESCALE [ Freescale ]
