ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
Table 2. Maximum Ratings (continued)
All voltages are with respect to ground, unless otherwise noted. Exceeding limits on any pin may cause permanent damage
to the device.
Rating
THERMAL RATINGS
Operating Ambient Temperature
Operating Junction Temperature
Storage Temperature
Peak Package Reflow Temperature During Reflow
T
A
T
J
T
STG
T
PPRT
-40 to 85
-40 to 125
-40 to 150
°C
°C
°C
°C
Symbol
Value
Unit
Notes
3. The limiting factor is junction temperature; taking into account the power dissipation, thermal resistance, and heat sinking.
4. The temperature of analog and MCU die is strongly linked via the package, but can differ in dynamic load conditions, usually because
of higher power dissipation on the analog die. The analog die temperature must not exceed 150 °C under these conditions.
5. Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
6. Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow
908E621
Analog Integrated Circuit Device Data
Freescale Semiconductor
7
FREESCALE [ FREESCALE SEMICONDUCTOR, INC ]
