Freescale Semiconductor, Inc.
GENERAL RELEASE SPECIFICATION
13.11 Control Timing
(VDD = 5.0 Vdc ± 10%, VSS = 0 Vdc, TA = –40 °C to +125 °C, unless otherwise note)
8
2
Characteristic
Symbol
Min
Max
Unit
Frequency of Operation
Crystal Option
fOSC
—
dc
4.2
4.2
MHz
External Clock Option
3
Internal Operating Frequency
Crystal (fosc ÷ 2)
fOP
—
dc
2.1
2.1
MHz
External Clock (fosc ÷ 2)
4
Cycle Time
tCYC
tOXOV
tILCH
tRL
476
—
—
100
100
—
ns
ms
ms
tCYC
ns
Crystal Oscillator Startup Time
Stop Recovery Startup Time (Crystal Oscillator)
RESET Pulse Width
5
—
1.5
125
*
6
Interrupt Pulse Width Low (Edge-Triggered)
Interrupt Pulse Period
tILIH
—
tILIL
—
tCYC
ns
7
OSC1 Pulse Width
tOH, tOL
tADON
tRCON
200
—
—
A/D On Current Stabilization Time
RC Oscillator Stabilization Time (A/D)
100
5.0
µs
8
—
µs
* The minimum period tILIL should not be less than the number of cycles it takes to execute the interrupt service
routine plus 21 tCYC
9
.
10
11
12
13
14
A
16
17
18
19
20
ELECTRICAL SPECIFICATIONS
Rev. 1.0
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