August 27, 1998
GENERAL RELEASE SPECIFICATION
SECTION 19
MECHANICAL SPECIFICATIONS
This section provides the mechanical dimensions for the 28-pin SOIC and
28-pin SSOP packages.
19.1 28-PIN SOIC (CASE 751F)
-A-
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
28
15
14X P
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A AND B DO NOT INCLUDE MOLD
PROTRUSION.
M
0.010 (0.25)
M
-B-
B
4. MAXIMUM MOLD PROTRUSION 0.15
(0.006) PER SIDE.
1
14
5. DIMENSION D DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.13
(0.005) TOTAL IN EXCESS OF D
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
28X D
M
M
S
S
B
0.010 (0.25)
T
A
R X 45°
MILLIMETERS
MIN MAX
17.80 18.05
INCHES
MIN MAX
C
DIM
A
-T-
0.701 0.711
0.292 0.299
0.093 0.104
0.014 0.019
0.016 0.035
0.050 BSC
-T-
SEATING
PLANE
B
7.40
2.35
0.35
0.41
7.60
2.65
0.49
0.90
26X G
C
D
K
F
F
G
J
1.27 BSC
0.23
0.13
0°
0.32
0.29
8°
0.009 0.013
0.005 0.011
J
K
M
P
0° 8°
0.395 0.415
10.05 10.55
0.25 0.75
R
0.010 0.029
MC68HC05SB7
REV 2.1
MECHANICAL SPECIFICATIONS
MOTOROLA
19-1
FREESCALE [ Freescale ]
