Freescale Semiconductor, Inc.
GENERAL RELEASE SPECIFICATION
SECTION 13
MECHANICAL SPECIFICATIONS
This section describes the dimensions of the dual in-line package (DIP) and small
outline integrated circuit (SOIC) MCU packages.
13.1 28-Pin Plastic Dual In-Line Package (Case 710-02)
NOTES:
1. POSITIONAL TOLERANCE OF LEADS (D),
SHALL BE WITHIN 0.25mm (0.010) AT
MAXIMUM MATERIAL CONDITION, IN
RELATION TO SEATING PLANE AND
EACH OTHER.
28
1
15
14
2. DIMENSION
WHEN FORMED PARALLEL.
3. DIMENSION DOES NOT INCLUDE
MOLD FLASH.
L
TO CENTER OF LEADS
B
B
MILLIMETERS
MIN MAX
INCHES
MIN MAX
DIM
A
B
C
D
F
36.45 37.21
13.72 14.22
1.435 1.465
0.540 0.560
0.155 0.200
0.014 0.022
0.040 0.060
L
A
C
3.94
0.36
1.02
5.08
0.56
1.52
N
G
H
J
2.54 BSC
0.100 BSC
0.065 0.085
0.008 0.015
0.115 0.135
1.65
0.20
2.92
2.16
0.38
3.43
J
H
G
K
L
M
K
SEATING
PLANE
15.24 BSC
0.600 BSC
F
D
0°
0.51
15°
1.02
0°
0.020 0.040
15°
M
N
MECHANICAL SPECIFICATIONS
Rev. 2.0
13-1
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