Table 10-2 56F8367/56F8167 ElectroStatic Discharge (ESD) Protection
Characteristic
Min
2000
200
Typ
—
Max
—
Unit
V
ESD for Human Body Model (HBM)
ESD for Machine Model (MM)
—
—
V
500
—
—
V
ESD for Charge Device Model (CDM)
6
Table 10-3 Thermal Characteristics
Value
Value
Characteristic
Comments
Symbol
Unit
Notes
160-pin LQFP
160MAPBGA
Junction to ambient
RθJA
38.5
39.90
°C/W
2
Natural convection
R
Junction to ambient (@1m/sec)
35.4
33
46.8
TBD
°C/W
°C/W
2
θJMA
R
Junction to ambient
Natural convection
Four layer board (2s2p)
Four layer board (2s2p)
1, 2
θJMA
(2s2p)
R
Junction to ambient (@1m/sec)
31.5
TBD
°C/W
1, 2
θJMA
(2s2p)
R
Junction to case
8.6
0.8
TBD
TBD
°C/W
°C/W
W
3
θJC
Ψ
Junction to center of case
I/O pin power dissipation
Power dissipation
4, 5
JT
P
User-determined
P D = (IDD x VDD + P I/O
(TJ - TA) / RθJA7
I/O
P
)
W
D
P
Maximum allowed PD
W
DMAX
1. Theta-JA determined on 2s2p test boards is frequently lower than would be observed in an application. Determined on 2s2p ther-
mal test board.
2. Junction to ambient thermal resistance, Theta-JA (R ) was simulated to be equivalent to the JEDEC specification JESD51-2
θJA
in a horizontal configuration in natural convection. Theta-JA was also simulated on a thermal test board with two internal planes
(2s2p, where “s” is the number of signal layers and “p” is the number of planes) per JESD51-6 and JESD51-7. The correct name
for Theta-JA for forced convection or with the non-single layer boards is Theta-JMA.
3. Junction to case thermal resistance, Theta-JC (R
), was simulated to be equivalent to the measured values using the cold
θJC
plate technique with the cold plate temperature used as the "case" temperature. The basic cold plate measurement technique is
described by MIL-STD 883D, Method 1012.1. This is the correct thermal metric to use to calculate thermal performance when
the package is being used with a heat sink.
4. Thermal Characterization Parameter, Psi-JT (Ψ ), is the "resistance" from junction to reference point thermocouple on top cen-
JT
ter of case as defined in JESD51-2. Ψ is a useful value to use to estimate junction temperature in steady-state customer en-
JT
vironments.
5. Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board) temperature,
ambient temperature, air flow, power dissipation of other components on the board, and board thermal resistance.
6. See Part 12.1 for more details on thermal design considerations.
7. TJ = Junction temperature
TA = Ambient temperature
TBD = numbers will be available late Q4 2005
56F8367 Technical Data, Rev. 9
140
Freescale Semiconductor
Preliminary
FREESCALE [ Freescale ]
