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56F807_1 参数 Datasheet PDF下载

56F807_1图片预览
型号: 56F807_1
PDF下载: 下载PDF文件 查看货源
内容描述: 16位数字信号控制器 [16-bit Digital Signal Controllers]
分类和应用: 控制器
文件页数/大小: 60 页 / 649 K
品牌: FREESCALE [ Freescale ]
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Measure the thermal resistance from the junction to where the leads are attached to the case. This definition  
is approximately equal to a junction to board thermal resistance.  
Use the value obtained by the equation (TJ – TT)/PD where TT is the temperature of the package case  
determined by a thermocouple.  
The thermal characterization parameter is measured per JESD51-2 specification using a 40-gauge type T  
thermocouple epoxied to the top center of the package case. The thermocouple should be positioned so  
that the thermocouple junction rests on the package. A small amount of epoxy is placed over the  
thermocouple junction and over about 1mm of wire extending from the junction. The thermocouple wire  
is placed flat against the package case to avoid measurement errors caused by cooling effects of the  
thermocouple wire.  
When heat sink is used, the junction temperature is determined from a thermocouple inserted at the  
interface between the case of the package and the interface material. A clearance slot or hole is normally  
required in the heat sink. Minimizing the size of the clearance is important to minimize the change in  
thermal performance caused by removing part of the thermal interface to the heat sink. Because of the  
experimental difficulties with this technique, many engineers measure the heat sink temperature and then  
back-calculate the case temperature using a separate measurement of the thermal resistance of the  
interface. From this case temperature, the junction temperature is determined from the junction-to-case  
thermal resistance.  
5.2 Electrical Design Considerations  
CAUTION  
This device contains protective circuitry to guard  
against damage due to high static voltage or electrical  
fields. However, normal precautions are advised to  
avoid application of any voltages higher than maximum  
rated voltages to this high-impedance circuit. Reliability  
of operation is enhanced if unused inputs are tied to an  
appropriate voltage level.  
Use the following list of considerations to assure correct operation:  
Provide a low-impedance path from the board power supply to each VDD pin on the controller, and from the  
board ground to each VSS pin.  
The minimum bypass requirement is to place 0.1 μF capacitors positioned as close as possible to the  
package supply pins. The recommended bypass configuration is to place one bypass capacitor on each of  
the VDD/VSS pairs, including VDDA/VSSA. Ceramic and tantalum capacitors tend to provide better  
performance tolerances.  
56F807 Technical Data Technical Data, Rev. 16  
56  
Freescale Semiconductor  
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