ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
Table 3. Maximum Ratings
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or
permanent damage to the device.
Ratings
ELECTRICAL RATINGS
Battery Input Supply Voltage (VIN) Pin
PVINx, RST, ONOFF, LION, DRV7
, VG, SCL, SDA and VOUT1-5 Pins
VDDI, COMPx, FBx, VREF7
, FREQ, and SS Pins
SW1-5 Pins
SW8, SW6
Pins
BTx Pins (Referenced to switch node)
BTx Pins to GND
VOUT8, VOUT6
Pins
VOUT7 Pin
Continuous Output Current
REG1
REG2,5
REG3
REG4
REG6,7
REG8
ESD Voltage
Human Body Model
Charge Device Model
THERMAL RATINGS
Maximum Junction Temperature
Storage Temperature
Maximum Power Dissipation (T
A
= 85°C)
THERMAL RESISTANCE
Thermal Resistance
Junction to Ambient
Junction to Board
Peak Package Reflow Temperature During Reflow
R
ΘJA
R
ΘJB
T
PPRT
26
10
°C
°C/W
T
J(MAX)
T
STG
PD
+150
-65 to +150
2.5
°C
°C
W
V
ESD1
V
ESD2
±1000
±500
V
500
500
550
300
60
30
V
SW-LOW
V
SW-HIGH
V
BT
-V
SW
V
BT
V
OUT-HIGH
V
OUT-NEG
V
IN
-0.3 to 6.0
-0.3 to 6.0
-0.3 to 3.0
-1.0 to 6.0
-1.0 to 27
-0.3 to 6.0
-0.3 to 27
-0.3 to 27
-10.0 to 0.3
V
Symbol
Value
Unit
V
V
V
V
V
V
mA
Notes
1. ESD testing is performed in accordance with the Human Body Model (HBM) (C
ZAP
= 100 pF, R
ZAP
= 1500
Ω),
and the Charge Device
Model (CDM), Robotic (C
ZAP
= 4.0pF).
2.
Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
Thermal Resistance is based on a four-layer board (2s2p)
Available only on the 34704A
4.
5.
34704
8
Analog Integrated Circuit Device Data
Freescale Semiconductor
FREESCALE [ FREESCALE SEMICONDUCTOR, INC ]
