ADDITIONAL DOCUMENTATION
THERMAL ADDENDUM (REV 2.0)
90
80
70
60
50
40
30
20
10
0
R
R
x
θ
θ
JA11
JA22
R
JA12 = R
θJA21
θ
0
300
600
Heat spreading area [mm²]
A
Figure 46. Device on Thermal Test Board RθJA
100
10
1
R
x
θJA11
R
θJA22
R
JA12 = R
θ
θJA21
0.1
1.00E-03 1.00E-02 1.00E-01 1.00E+00 1.00E+01 1.00E+02 1.00E+03 1.00E+04
Time[s]
Figure 47. Transient Thermal Resistance RθJA
,
1W Step response,Device on Thermal Test Board Area A = 600 (mm2)
33981
Analog Integrated Circuit Device Data
Freescale Semiconductor
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