ADDITIONAL DOCUMENTATION
THERMAL ADDENDUM (REV 2.0)
Transparent Top View
GND
13
A
VPWR
14
15
16
OUT
OUT
33981 Pin Connections
16-Pin PQFN
0.90 mm Pitch
12.0 mm x 12.0 mm Body
with exposed pads
Figure 45. Thermal Test Board
Device on Thermal Test Board
Table 8. Thermal Resistance Performance
Material:
Single layer printed circuit board
1 = Power Chip, 2 = Logic Chip (°C/W)
FR4, 1.6 mm thickness
Area A
(mm2)
Thermal
Resistance
Cu traces, 0.07 mm thickness
m = 1,
n = 1
m = 1, n = 2
m = 2, n = 1
m = 2,
n = 2
Outline:
Area A:
80 mm x 100 mm board area,
including edge connector for thermal
testing
Ρ
0
66
47
43
51
37
34
84
73
70
θJAmn
300
600
Cu heat-spreading areas on board
surface
RθJA is the thermal resistance between die junction and
ambient air.
Ambient Conditions: Natural convection, still air
This device is a dual die package. Index m indicates the
die that is heated. Index n refers to the number of the die
where the junction temperature is sensed.
33981
Analog Integrated Circuit Device Data
Freescale Semiconductor
34
FREESCALE [ Freescale ]
