ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
Table 2. Maximum Ratings
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or
permanent damage to the device.
Rating
Supply Voltage
Input Voltage
FS Status Output
Continuous Current
ESD Voltage for VW Package
Human Body Model
Machine Model
Storage Temperature
Ambient Operating Temperature
Operating Junction Temperature
Peak Package Reflow Temperature During Reflow
Approximate Junction-to-Board Thermal Resistance (and Package
Dissipation = 6.0 W)
Notes
1.
2.
3.
4.
5.
6.
7.
V
ESD1
V
ESD2
T
STG
T
A
T
J
T
PPRT
R
θ
JB
±2000
±200
-65 to 150
-40 to 125
-40 to 150
~5.0
°C
°C
°C
°C
°C/W
Symbol
V+
V
IN
V
FS
I
OUT
Value
40
-0.1 to 7.0
7.0
5.0
Unit
V
V
V
A
V
Exceeding the input voltage on IN1, IN2, D1, or D2 may cause a malfunction or permanent damage to the device.
Exceeding the pull-up resistor voltage on the open drain FS pin may cause permanent damage to the device.
Continuous current capability so long as junction temperature is
≤
150
°
C.
ESD1 testing is performed in accordance with the Human Body Model (C
ZAP
= 100 pF, R
ZAP
= 1500
Ω).
ESD2 testing is performed in accordance with the Machine Model (C
ZAP
= 200 pF, R
ZAP
= 0
Ω).
The limiting factor is junction temperature, taking into account the power dissipation, thermal resistance, and heatsinking.
Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
Exposed heatsink pad plus the power and ground pins comprise the main heat conduction paths. The actual R
θ
JB
(junction-to-PC board)
values will vary depending on solder thickness and composition and copper trace.
9.
33886
4
Analog Integrated Circuit Device Data
Freescale Semiconductor
FREESCALE [ FREESCALE SEMICONDUCTOR, INC ]
