ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
Table 2. Maximum Ratings (continued)
All voltages are with respect to ground unless otherwise noted.
Rating
THERMAL RESISTANCE
,
Junction-to-Ambient, Natural Convection, Single-Layer Board (1s)
HSOP
QFN
SOIC
Junction-to-Ambient, Natural Convection, Four-Layer Board (2s2p)
HSOP
QFN
SOIC
Junction-to-Board (Bottom)
HSOP
QFN
SOIC
Junction-to-Case (Top)
HSOP
QFN
SOIC
R
θ
JC
0.2
1.2
1.0
R
θ
JB
3.0
10
TBD
°C/W
R
θ
JMA
R
θ
JA
°C/W
41
85
72
°C/W
18
27
TBD
°C/W
Symbol
Value
Limit
Notes
12. Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board) temperature, ambient
temperature, air flow, power dissipation of other components on the board, and board thermal resistance.
13. Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on the top
surface of the board near the package.
14. Per SEMI G38-87 and JEDEC JESD51-2 with the single-layer board horizontal.
15. Per JEDEC JESD51-6 with the board horizontal.
16. Indicates the average thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC
883, Method 1012.1) with the cold plate temperature used for the case temperature.
17. This value will be included when available.
33882
6
Analog Integrated Circuit Device Data
Freescale Semiconductor
FREESCALE [ FREESCALE SEMICONDUCTOR, INC ]
