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33879_12 参数 Datasheet PDF下载

33879_12图片预览
型号: 33879_12
PDF下载: 下载PDF文件 查看货源
内容描述: 可配置8路串联开关,负载开路检测电流关闭 [Configurable Octal Serial Switch with Open Load Detect Current Disable]
分类和应用: 开关
文件页数/大小: 23 页 / 645 K
品牌: FREESCALE [ Freescale ]
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ELECTRICAL CHARACTERISTICS  
MAXIMUM RATINGS  
ELECTRICAL CHARACTERISTICS  
MAXIMUM RATINGS  
Table 3. 33879 Maximum Ratings  
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or  
permanent damage to the device.  
Ratings  
Symbol  
Value  
Unit  
ELECTRICAL RATINGS  
Supply Voltage(1)  
V
V
-0.3 to 7.0  
-0.3 to 7.0  
V
DD  
DD  
DC  
CS, DI, DO, SCLK, IN5, IN6, and EN(1)  
Supply Voltage(1)  
V
V
DC  
DC  
V
V
PWR  
PWR  
33879  
-16 to 40  
-16 to 45  
33879A  
Output Clamp Energy(2)  
ESD Voltage(3)  
E
50  
mJ  
V
CLAMP  
Human Body Model 33879  
Machine Model 33879  
V
±450  
±100  
±2000  
±200  
ESD1  
ESD2  
ESD1  
ESD2  
V
Human Body Model 33879A  
Machine Model 33879A  
V
V
THERMAL RATINGS  
Operating Temperature  
Ambient  
°C  
TA  
TJ  
-40 to 125  
-40 to 150  
-40 to 125  
Junction  
TC  
Case  
Storage Temperature  
Power Dissipation(4)  
T
-55 to 150  
1.7  
°C  
W
STG  
P
D
Thermal Resistance  
°C/W  
R
71  
Junction to Ambient  
θJA  
R
1.2  
Between the Die and the Exposed Die Pad  
θJC  
Peak Package Reflow Temperature During Reflow (5), (6)  
°C  
TPPRT  
Note 6  
Notes  
1. Exceeding these limits may cause malfunction or permanent damage to the device.  
2. Maximum output clamp energy capability at 150°C junction temperature using single non-repetitive pulse method with I = 350 mA.  
3. ESD1 testing is performed in accordance with the Human Body Model (CZAP = 100 pF, RZAP = 1500 Ω), ESD2 testing is performed in  
accordance with the Machine Model (CZAP = 200 pF, RZAP = 0 Ω).  
4. Maximum power dissipation at T = 25°C with no heatsink used.  
A
5. Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may  
cause malfunction or permanent damage to the device.  
6. Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow  
Temperature and Moisture Sensitivity Levels (MSL), Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes  
and enter the core ID to view all orderable parts. (i.e. MC33xxxD enter 33xxx), and review parametrics.  
33879  
Analog Integrated Circuit Device Data  
Freescale Semiconductor  
6
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