ADDITIONAL DOCUMENTATION
THERMAL ADDENDUM (REV 2.0)
Device on Thermal Test Board
Table 26. Thermal Resistance Performance
Material:
Single layer printed circuit board
1 = Power Chip, 2 = Logic Chip (°C/W)
FR4, 1.6 mm thickness
Area A
(mm2)
Thermal
Resistance
m = 1,
n = 1
m = 1, n = 2
m = 2, n = 1
m = 2,
n = 2
Cu traces, 0.07 mm thickness
Cu buried traces thickness
0.035 mm
0
46.42
41.60
40.02
38.86
38.04
37.03
32.90
31.63
30.68
29.99
53.82
51.27
55.05
49.47
48.63
150
300
450
600
Outline:
76.2 mm x 114.3 mm board area,
including edge connector for thermal
testing, 74 mm x 74 mm buried
layers area
RθJAmn
Area A:
Cu heat-spreading areas on board
surface
RθJA is the thermal resistance between die junction and
ambient air.
This device is a dual die package. Index m indicates the
die that is heated. Index n refers to the number of the die
where the junction temperature is sensed.
Ambient Conditions: Natural convection, still air
65.00
60.00
55.00
50.00
45.00
40.00
35.00
30.00
25.00
0
100
200
300
400
500
600
Heat spreading area [sqmm]
RJA11
RJA12=RJA21
RJA22
Figure 20. Steady State Thermal Resistance in Dependance on Heat Streading Area;
1s JEDEC Thermal Test Board with Spreading Areas
10XS3412
Analog Integrated Circuit Device Data
Freescale Semiconductor
48
FREESCALE [ Freescale ]
