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FDS6912 参数 Datasheet PDF下载

FDS6912图片预览
型号: FDS6912
PDF下载: 下载PDF文件 查看货源
内容描述: 双N沟道逻辑电平PWM优化的PowerTrench MOSFET [Dual N-Channel Logic Level PWM Optimized PowerTrench MOSFET]
分类和应用: 晶体晶体管功率场效应晶体管开关脉冲光电二极管
文件页数/大小: 5 页 / 76 K
品牌: FAIRCHILD [ FAIRCHILD SEMICONDUCTOR ]
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FDS6912
Electrical Characteristics
Symbol
BV
DSS
∆BV
DSS
∆T
J
I
DSS
I
GSSF
I
GSSR
T
A
= 25°C unless otherwise noted
Parameter
Drain–Source Breakdown Voltage
Breakdown Voltage Temperature
Coefficient
Zero Gate Voltage Drain Current
Gate–Body Leakage, Forward
Gate–Body Leakage, Reverse
(Note 2)
Test Conditions
V
GS
= 0 V, I
D
= 250
µA
I
D
= 250
µA,
Referenced to 25°C
V
DS
= 24 V,
V
GS
= 25 V,
V
GS
= –25 V
V
GS
= 0 V
T
J
= 55°C
V
DS
= 0 V
V
DS
= 0 V
Min
30
Typ
Max Units
V
Off Characteristics
20
1
10
100
–100
mV/°C
µA
nA
nA
On Characteristics
V
GS(th)
∆V
GS(th)
∆T
J
R
DS(on)
Gate Threshold Voltage
Gate Threshold Voltage
Temperature Coefficient
Static Drain–Source
On–Resistance
On–State Drain Current
Forward Transconductance
V
DS
= V
GS
, I
D
= 250
µA
I
D
= 250
µA,
Referenced to 25°C
V
GS
= 10 V,
V
GS
= 4.5 V,
I
D
= 6 A
T
J
= 125°C
I
D
= 4.9 A
V
DS
= 5 V
I
D
= 6 A
1
2
–5
0.024
0.034
0.035
3
V
mV/°C
0.028
0.048
0.042
I
D(on)
g
FS
V
GS
= 10 V,
V
DS
= 10 V,
20
20
A
S
Dynamic Characteristics
C
iss
C
oss
C
rss
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
(Note 2)
V
DS
= 15 V,
f = 1.0 MHz
V
GS
= 0 V,
740
170
75
pF
pF
pF
Switching Characteristics
t
d(on)
t
r
t
d(off)
t
f
Q
g
Q
gs
Q
gd
Turn–On Delay Time
Turn–On Rise Time
Turn–Off Delay Time
Turn–Off Fall Time
Total Gate Charge
Gate–Source Charge
Gate–Drain Charge
V
DD
= 15 V,
V
GS
= 10 V,
I
D
= 1 A,
R
GEN
= 6
8
13
18
8
16
24
29
16
10
ns
ns
ns
ns
nC
nC
nC
V
DS
= 10 V,
V
GS
= 5 V
I
D
= 6 A,
7
3.8
2.5
Drain–Source Diode Characteristics and Maximum Ratings
I
S
V
SD
Maximum Continuous Drain–Source Diode Forward Current
Drain–Source Diode Forward
Voltage
V
GS
= 0 V,
I
S
= 1.3 A
(Note 2)
1.3
0.75
1.2
A
V
Notes:
1.
R
θJA
is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of
the drain pins. R
θJC
is guaranteed by design while R
θCA
is determined by the user's board design.
a) 78°/W when
2
mounted on a 0.5in
pad of 2 oz copper
b) 125°/W when
mounted on a 0.02
2
in pad of 2 oz
copper
c) 135°/W when mounted on a
minimum mounting pad.
Scale 1 : 1 on letter size paper
2.
Pulse Test: Pulse Width < 300µs, Duty Cycle < 2.0%
FDS6912 Rev E (W)