SPICE Thermal Model
JUNCTION
th
REV Aug 2002
FDS3692
Copper Area =1.0 in2
CTHERM1 TH 8 2e-3
CTHERM2 8 7 5e-3
CTHERM3 7 6 1e-2
CTHERM4 6 5 4e-2
CTHERM5 5 4 9e-2
CTHERM6 4 3 2e-1
CTHERM7 3 2 1
RTHERM1
RTHERM2
RTHERM3
RTHERM4
RTHERM5
RTHERM6
RTHERM7
RTHERM8
CTHERM1
CTHERM2
CTHERM3
CTHERM4
CTHERM5
CTHERM6
CTHERM7
CTHERM8
8
7
CTHERM8 2 TL 3
RTHERM1 TH 8 1e-1
RTHERM2 8 7 5e-1
RTHERM3 7 6 1
RTHERM4 6 5 5
RTHERM5 5 4 8
RTHERM6 4 3 13
RTHERM7 3 2 19
RTHERM8 2 TL 29.7
6
5
SABER Thermal Model
Copper Area = 1.0 in2
template thermal_model th tl
thermal_c th, tl
{
ctherm.ctherm1 th 8 =2e-3
ctherm.ctherm2 8 7 =5e-3
ctherm.ctherm3 7 6 =1e-2
ctherm.ctherm4 6 5 =4e-2
ctherm.ctherm5 5 4 =9e-2
ctherm.ctherm6 4 3 =2e-1
ctherm7 3 2 1
4
3
2
ctherm8 2 tl 3
rtherm.rtherm1 th 8 =1e-1
rtherm.rtherm2 8 7 =5e-1
rtherm.rtherm3 7 6 =1
rtherm.rtherm4 6 5 =5
rtherm.rtherm5 5 4 =8
rtherm.rtherm6 4 3 =13
}
tl
CASE
TABLE 1. THERMAL MODELS
COMPONANT
CTHERM6
CTHERM7
CTHERM8
RTHERM6
RTHERM7
RTHERM8
0.04 in2
3.2e-1
8.5e-1
0.3
0.28 in2
3.5e-1
9.0e-1
1.8
0.52 in2
4.0e-1
9.0e-1
2.0
0.76 in2
4.0e-1
9.0e-1
2.0
1.0 in2
4.0e-1
9.0e-1
2.0
24
18
12
10
9
36
21
18
16
15
53
37
30
28
23
©2003 Fairchild Semiconductor Corporation
FDS3672 Rev. B
FAIRCHILD [ FAIRCHILD SEMICONDUCTOR ]
